Yangbo Wei 韦杨波
I am a second-year Ph.D. student in the School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University (SJTU), and the School of Computer Science, Eastern Institute of Technology, supervised by Prof. Lei He (IEEE Fellow). Prior to my journey in SJTU, I obtained my B.Sc. degree from Southeast University (SEU) in 2024.
My research explores agentic and efficient AI systems across reasoning, hardware acceleration, LLM serving, and electronic design automation.
Agentic reasoning, Multi-Agent Systems (MAS), Efficient LLMs.
Energy-efficient AI inference, ASIC & FPGA design for AI, Memory- and Kernel-level optimization.
Efficient LLM serving, Parallelism & memory optimization, Kernel-level execution, Runtime scheduling.
LLM-based agents for electronic design automation (EDA).
🔥 News
- 2026.04: 🎉🎉 Two papers were accepted by ICML 2026.
- 2025.11: 🚀🚀 Two papers were accepted by ASPLOS 2026 (10.6%) and AAAI 2026 (17.6%).
- 2024.05: 🏆🏆 Our paper received the Best Paper Award at ISEDA 2024!
📝 Publications
Conference Publications
- [C14] CCF-A Topological Active Inference for Task Disambiguation
Yangbo Wei, et al.
International Conference on Machine Learning (ICML), 2026. - [C13] CCF-A EvoMAS: Heuristics in the Loop–Evolving Smarter Agentic Workflows
Yangbo Wei, et al.
International Conference on Machine Learning (ICML), 2026. - [C12] CCF-A PCBgen: Self-Evolving LLM Agent for Verifiable Specification-to-Schematic PCB Design
Yangbo Wei (Co-first), et al.
Design Automation Conference (DAC), 2026. - [C11] CCF-A From Fluid Dynamics to Chip Design: Foundation Neural Operators Address Data Bottleneck in 3D-ICs Thermal Simulation
Yangbo Wei (Co-first), et al.
Design Automation Conference (DAC), 2026. - [C10] CCF-A Mixture-of-Trees: Learning to Select and Weigh Reasoning Paths for Efficient LLM inference
Yangbo Wei, et al.
AAAI Conference on Artificial Intelligence (AAAI), 2026. - [C9] CCF-A DFVG: A Heterogeneous Architecture for Speculative Decoding with Draft-on-FPGA and Verify-on-GPU
Yangbo Wei (Co-first), et al.
Architectural Support for Programming Languages and Operating Systems (ASPLOS), 2026. - [C8] CCF-A MedAtlas: Evaluating LLMs for Multi-Round, Multi-Task Medical Reasoning Across Diverse Imaging Modalities and Clinical Text
Authors, …, Yangbo Wei (3rd Author).
AAAI Conference on Artificial Intelligence (AAAI oral), 2026. - [C7] CCF-A MECoT: Markov emotional chain-of-thought for personality-consistent role-playing
Yangbo Wei, et al.
Annual Meeting of the Association for Computational Linguistics (ACL findings), 2025. - [C16] CCF-B MambaDATG: Domain-Adaptive Tri-Plane-Gated Pre-training for 3D Abdominal Segmentation
Yangbo Wei* (Co-first), et al.
IEEE International Conference on Acoustics, Speech, and Signal Processing (ICASSP), 2026. - [C15] CCF-B H3DE-Net: Efficient and Accurate 3D Landmark Detection in Medical Imaging
Yangbo Wei* (Co-first), et al.
IEEE International Conference on Bioinformatics and Biomedicine (BIBM), 2025. - [C6] CCF-B MoE-OPU: An FPGA Overlay Processor Leveraging Expert Parallelism for MoE-based LLM
Yangbo Wei* (Co-first), et al.
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2025. - [C5] CCF-C dLLM-OPU: An FPGA Overlay Processor for Accelerated Diffusion Large Language Models
Yangbo Wei, et al.
Asia and South Pacific Design Automation Conference (ASPDAC), 2026. - [C4] CCF-C Vflow: Discovering optimal agentic workflows for verilog generation
Yangbo Wei, et al.
Asia and South Pacific Design Automation Conference (ASPDAC), 2026. - [C3] CCF-C FlightOPU: An FPGA Overlay Processor for LLM with HBM-Aware Multi-Die Architecture
Authors, …, Yangbo Wei (3rd Author).
International Conference on Field-Programmable Technology (FPT invited), 2025. - [C2] CCF-C BOPRO: Towards New Style Bayesian Optimization with Large Language Models
Authors, …, Yangbo Wei (3rd Author).
International Conference on Intelligent Computing (ICIC), 2025. - [C1] Best Paper Knowledge Transfer for GaN HEMTs Parameter Extraction Based on Hybrid Model
Yangbo Wei, et al.
International Symposium on Electronic Design Automation (ISEDA), 2024. 🏆
Journal Publications
- [J1] CCF-B ModelGen: Automating Semiconductor Parameter Extraction with Large Language Model Agents
Yangbo Wei, et al.
ACM Transactions on Design Automation of Electronic Systems (TODAES).
🎖 Honors and Awards
Academic Awards
- 2026 Silver Reviewer Award, ICML 2026 (International Conference on Machine Learning)
- 2024.05 Best Paper Award, ISEDA 2024 (International Symposium on Electronic Design Automation)
Competitions
- 2023 First Prize (Meritorious Winner), Mathematical Contest in Modeling (MCM/ICM)
- 2023 Second Prize, China Undergraduate Mathematical Contest in Modeling (National Level)
- 2022 First Prize, Southeast University Electronic Design Competition
💼 Experience
Academic Service
- 2026 Reviewer, ICML 2026 (International Conference on Machine Learning)
- 2026 Reviewer, NeurIPS 2026 (Conference on Neural Information Processing Systems)
📖 Education
- 2024.09 - Present, Ph.D. Student in Integrated Circuit Engineering, Shanghai Jiao Tong University (SJTU).
- 2020.09 - 2024.06, B.Sc. Southeast University (SEU).
🏖️ Life & Misc
“Don’t Panic. In a universe this big, a bug is nothing.”